Applications

METALLIZED SUBSTRATES/ HYBRID CIRCUITRY/ BRAZING SUBSTRATES
Metallization is useful for microwave accessories, microwave resistor chips, microwave attenuator chips, hybrid circuits, package lids, wafer scale packaging, soldered joints, hermetic seals, ceramic substrates and bus bars. Custom circuitry on ceramic and flexible materials or just metalized ceramic is also available. Resistive material is usually E- beam or sputter deposited Ni Cr or Tantalum Nitride, (Ta N). Additional coatings are later applied with combinations of Titanium Tungsten, Chrome, Nickel, Copper, and/or Gold.

Semiconductor substrates

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